CMP Systems

Applied Materials' CMP (chemical mechanical planarization) systems deliver the superior planarization and high reliability needed for emerging chip technologies. Our market-leading Mirra Mesa™ platform features a patented four-head/three-platen architecture that enables continuous polishing of multiple wafers while offering advanced features such as an in-situ rate monitor (ISRM™) endpoint system to ensure precise process control.

Mirra Mesa™ CMP System
The new Mirra Mesa CMP system integrates the Mirra polisher with Applied Materials' Mesa cleaner to provide a total dry-in, dry-out solution in one of the smallest footprints in the industry.

Advanced Features
Titan Head™ Wafer Carrier
In-Situ Rate Monitor (ISRM™) Endpoint System
Mesa Cleaner

CMP Processes
The Mirra Mesa's growing selection of CMP processes cover a wide range of metal and dielectric planarization applications, including shallow trench isolation and copper interconnect.

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