|
|
|
|
Dielectric Etch eMAX™
The Dielectric Etch eMAX™ system leverages the most advanced developments in medium-density plasma etch technology to bring you high-performance sub-0.13µm etch capability with extreme flexibility and proven cost effectiveness. eMAX provides outstanding photoresist selectivity, CD capability and profile control, delivering truly superior on-wafer results for all of your most technically challenging and cost-sensitive dielectric etch applications: high-aspect-ratio (HAR) contacts, self-aligned contacts (SAC), bi-level contacts, damascene structures, and logic contacts. By incorporating proven innovations from multiple dielectric etch technologies, eMAX provides outstanding results with the market's broadest process window. The chamber's low pressure/high gas flow regime, exclusive controllable magnetic field, high RF power capability, and advanced polymer management techniques deliver etch rates of over 6000Å/min on high-selectivity applications. With the system's rapid wafer handling and 4-chamber capability, these high etch rates translate to an exceptional degree of productivity, with reliably high throughputs and excellent uniformity and repeatability of results. No other dielectric etch system can match eMAX's combination of applications capability, process results, flexibility, and productivity edge for advanced sub-0.13µm production.
|
|
|
|
|
 Download Printable Ad (403KB)
|
|
|
About Dry Plasma Etch Process
Download Adobe Acrobat Reader
|
|
|
|
|
